Payment & Shipping Terms:
|Laser Wavelength:||355nm||Laser Source:||UV Diode Module|
|Working Range:||100X100mm||Marking Speed:||40Meter/Minute|
|Warranty:||2 Years||Maintenance:||Daily Free|
|Laser Power:||15W||Technical Support:||Whole Life|
15W UV Flying Laser Marking Machine For Medical Containers and Nonmetal Materials
Brittleness material like fire-proof material, glass, ceramics, monocrystalline silicon and polycrystalline silicon etc. Special material like small Flexible Printed Circuit etc
Applied Industries: It can be applied for precision marking, micro-processing and cold processing in micro-electronics industry. Marking, scribing, carving, cutting and surface processing on various type of chips, flexible printed circuit board, ultra-thin glass, LCD screen, textile, sheet ceramic, semiconductor wafer, IC grain, sapphire, polymeric film, brittleness material and Special plastic packaging etc.
|Machine model number:||LD-FEM-UV3015|
|Laser beam Quality:||M2:＜1.5|
|Laser Repeat Frequency:||≤100kHz|
|Standard Marking Range:||100x100mm ( Static status)|
|Marking Speed||0-40m/minute on line height 3mm 8-30 characters.|
|Cooling System:||Air cooler + Water cooler|
|Power Supply||AC220V/Single phase/50Hz/10A 1KW|
1. Adopt high quality UV laser source, wave length is 355nm
2. Compare with normal laser marking machine, the focused spot of UV laser is smaller and marking result is better precision. It has incomparable advantage than other laser machines for applied precision marking, precision cutting and micro processing on the special materials.
3. It suitable for precision micro machining, cold processing. Compare with infrared diode pumped machine, it has higher absorption rate of metal, monocrystalline silicon, polycrystalline silicon, industrial ceramics, glass etc, can used for marking, cutting, scribing and cutting for small Flexible Printed Circuit.
Contact Person: Collins Zhang